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高性能氧化锆承烧板
高性能氧化锆承烧板

   高性能氧化锆承烧板,是电子产品烧制过程中的承烧窑具,适用于磁性材料、陶瓷电容、PTC、电感、压电陶瓷等行业。

  所用材料采用高纯氧化锆制成,与其它材料制成的承烧板相比,具有与所承烧的电子产品不发生化学反应和粘连的优点,能保障电子产品性能的稳定性和一致性,提高烧成合格率;机械性能优良,能承载大量电子产品;热震稳定性好,使用寿命长。

  High Capability Zirconia Board: It is burning pudding in the electron products, widely used in magnetism material, porcelain capacitor, PTC, piezoceramics industry 
The material is made of high purity zirconia, it will not rise chemistry reaction or conglutination in the burning electron products compared with other burning beaker of different material. It guarantee the stability &consistency of the electron products. It also improve the burning eligibility, machine performance is choiceness. It can load a wide large of electron products; hot vibrate stability is well, bestow lift-span is long.

一、常用规格 (mm)

敷 板
敷 板
敷 板
异 型 条
112*112
300*150
98*98
93*83
 
113*113
170*170
145*145
140*140
 
130*130
150*150
115*115
¢117
83*83
V60*18
G72*10
G83*12

 
注: 厚度可按客户需要定做规格

Ⅰ.Dimension in common usage(mm)

Apply the board
Apply the board
Apply the board
Different piece
112*112
300*150
98*98
93*83
 
113*113
170*170
145*145
140*140
 
130*130
150*150
115*115
¢117
83*83
V60*18
G72*10
G83*12

 
Note :The thickness can be produced by customers’ require



二、理化指标

化学成分
标准指标
物理性能
标准指标
ZrO2
>93%
体积密度(g/cm3)
3.8~4.5
CaO
>3.6%
显气孔率(%)
18~28
SiO2
<0.4%
荷重软化温度(℃)
1650
Al2O3
<2.0%
膨胀系数{1000℃ (1/℃)}
8.7*10-6
Fe2O3
<0.1%
热震稳定性( 1100℃)
>>20次

Ⅱ. High Capability Zirconia Board Technique Index

Chemical Composition
Index
physical property
Index
ZrO2
>93%
volume concentration(g/cm3)
3.8~4.5
CaO
>3.6%
apparent porosity(%)
18~28
SiO2
<0.4%
refractoriness under load(℃)
1650
Al2O3
<2.0%
swell factor {1000℃ (1/℃)}
8.7*10-6
Fe2O3
<0.1%
hot shake stability( 1100℃)
>>20

 

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